SPECIFICATION GUIDE

Reference to:
Wafer Form, Size & Shape - Surface & Edge finish - Orientation flat and Dimensional tolerances.
MACHINED
It is a standard finish where the surface of the edge retains the marks of a fine diamond tool. Some
minor voids and chipping may be present.
LASER CUT
Beveled
When the wafer is sized by the laser the result is a very fine and smooth edge, free of chips and
voids.

Picture:
1.00mm thick wafer
LASER CUT & POLISHED
Beveled
It is our special proprietary process, which provides the finest most resilient edge finish to a quartz
wafer. The Laser Polishing of the edge increases the hardness of the edge and becomes more
resistant to chipping during handling, transportation and repeated insertion into the processing
chamber. It has been successfully tested up to 100 cycles of metal-deposition, removal of
metal-deposition and re-polishing of the same wafer in a fully automated environment.

Picture:
1.50mm thick wafer
WAFER SIZE
Compatible with standard Silicon wafer sizes.
Wafers are also available in custom sizes and thickness.
FLAT
Size
Actual
(mm)
Size
Actual
(inch)
Size
Nominal
Call out
(inch)
Thickness
(mm)
Size
(mm)
+/- 1.0mm
75
2.953
3
0.50
0.75
1.00
1.50
-
100
3.937
4
0.50
0.75
1.00
1.50
32.5
125
4.921
5
0.50
0.75
1.00
1.50
42.5
150
5.905
6
0.50
0.75
1.00
1.50
47.5
200
7.874
8
0.50
0.75
1.00
1.50
57.5
300
11.811
12
0.50
0.75
1.00
1.50
-
SURFACE FINISH
GRADES
&
Dimensional Tolerances
 OPTICAL "E"

This high quality finish is for
applications where optical
qualities, such as flatness,
parallelism, surface quality,
and etc. is critical and must
be of the highest grade
 VIEWPORT "S"

This is a ground and polished
clear finish appropriate for
many applications. The
specifications are loosened
up in some area depending
on the application to lower
cost
 COMMERCIAL "R"

This finish refers to a piece of
quartz glass cut to size.
Tolerances are fairly liberal,
and are for use as a heat
shield in a boat and or other
non-critical applications
where low cost is the primary
consideration
Diameter (OD) (+/- mm)
0.10
0.10
0.10
Thickness (+/- mm)
0.05
0.10
0.10
Flatness (microns)
< 30
< 30
< 50
LTV - (microns/20mm2)
< 3.0
< 7.0
< 10
TTV - (microns)
< 10
< 20
< 30
Surface Roughness (nm)
< 1.00
< 2.00
< 3.00
Chips & Voids (microns Max.)
none
50
100
Inclusions (microns Max.)
none
20
50
Strain
none
none
none
Scratch & Dig
10/5
20/10
60/40
Hills
none
none
none
Pits (microns Max.)
none
50
50
Bow & Warp
-
-
-
 
EDGE FORM
CHAMFERED
 With a fine diamond tool we remove the sharp edges of the wafer after the OD is machined to final
dimension.
DUAL BEVEL
 The dual bevel is accurately machined at 45 ° to 33% of thickness from both sides leaving approx.
33% in the center section.
SINGLE BEVEL
 The single bevel can be accurately cut at 10 ° to 45 ° of angle / 10 % to 100% of thickness of the
wafer
Quartz Unlimited LLC
1181 South Rogers Circle, Suite 11
Boca Raton Florida 33487
Toll Free  (888) 264-3879
Fax:          (888) 264-3879
Main:        (561) 999-4340
sales@qullc.com