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Core Competency &
Differentiating Unique Capabilities
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Laser drilling, cutting, marking engraving and
contouring. Digitally-controlled CO2 lasers in
a multi-axis motion system for drilling and
cutting. Laser and scanning optics for
micromachining and engraving. Capabilities
al-so include annealing and ultrasonic
cleaning.
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Laser Micromachining for patterns and
channels in substrates. Proprietary Laser
Polishing technology enhances the mechanical
resilience of quartz wafers edges. Large
volume capacity with absolute repeatability to
meet “Copy Exact” requirements.
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Diamond machining a variety of features into
quartz and other hard to process materials.
Located in a 12,000 square feet facility, this
partner employs multiple shifts, as needed.
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Experienced work force processes parts with
zero tolerance and JIT delivery for major
industries, as well as government and defense
contracts. Extremely sophisticated processes
and quality control instrumentation.
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Fused Quartz
Fused Silica
Pyrex,
Borofloat
Borosilcate
Soda Lime
BK7, B270
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Diamond machining for fragile and exotic
materials, as well as various grades of
glasses. Operating in an 110,000 square
feet facility with employees working in
multiple shifts.
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Over twenty five years of experience of working
with quartz and similar materials. This partner
is a high volume producer.
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Fused Quartz
Fused Silica
Pyrex,
Borofloat
Borosilcate
Soda Lime
BK7, B270
Sapphire
Silicon
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